Amkor Technology is a provider of outsourced semiconductor packaging (also referred to as assembly) and test services. Co.'s package services are divided into three families: chip scale packages, ball grid array packages and leadframe packages. In addition, Co. provides other packaging services, such as wafer bumping which supports its flip chip and wafer-level packages. Co. also provides a range of semiconductor testing services including wafer testing or probe, various types of final testing, strip testing and end-of-line test services up to and including final shipping. Co. also provides logistical services including security certification and anti-counterfeit measures.
Wed, Dec 11, 5:30 PM, Zacks Broadcom Revises Q4 Guidance - Analyst Blog Broadcom recently revised its guidance for fourth quarter 2013 to better reflect its current expectations in accordance with the present market conditions.
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